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BYD31 データシート - Philips Electronics

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部品番号
BYD31

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page
9 Pages

File Size
53 kB

メーカー
Philips
Philips Electronics Philips

DESCRIPTION
Cavity free cylindrical glass package through Implotec(1) technology. This package is hermetically sealed and fatigue free as coefficients of expansion of all used parts are matched.


FEATURES
• Glass passivated
• High maximum operating temperature
• Low leakage current
• Excellent stability
• Guaranteed avalanche energy absorption capability
• Available in ammo-pack.

 

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