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BYD167 データシート - Philips Electronics

BYD167 image

部品番号
BYD167

コンポーネント説明

Other PDF
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PDF
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page
8 Pages

File Size
45.7 kB

メーカー
Philips
Philips Electronics Philips

DESCRIPTION
Cavity free cylindrical glass SOD87 package through Implotec™(1) technology. The SOD87 package is hermetically sealed and fatigue free as coefficients of expansion of all used parts are matched.


FEATURES
• Glass passivated
• High maximum operating temperature
• Low leakage current
• Excellent stability
• Available in ammo-pack
• Smallest surface mount rectifier package.

 

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