FEATURES
● Void Free Vacuum Die Soldering For
   Maximum Mechanical Strength and Heat
   Dissipation (Solder Voids:
   Typical < 2%, Max. < 10% of Die Area)
● Biggest Effective Die Area for the 35 Amp
   Class of Soza Diode Cells
● High Temperature Solder (Solidus 287 °C,
   Liquidus 296 °C) to Allow Higher Operating
   And Assembly Temperatures
● Copper Headers Are Silver Plated For
   Easy Soldering And Superior Solder Joints
● Largest Diameter Header Is Cathode
   RoHS COMPLIANT