PRODUCT DESCRIPTION
The AWT6135 meets the increasing demands for higher efficiency and linearity in CDMA 1XRTT handsets. The PA module is optimized for VREF= +2.8 V, a requirement for compatibility with the Qualcomm® 6000 chipset. The device is manufactured on an advanced InGaP HBT MMIC technology offering state-of-the-art reliability, temperature stability, and ruggedness.

FEATURES
• InGaP HBT Technology
• High Efficiency: 40%
• Low Quiescent Current: 48 mA
• Low Leakage Current in Shutdown Mode: <1 µA
•VREF= +2.8 V (+2.7 V min over temp)
• Optimized for a 50 Ω System
• Low Profile Miniature Surface Mount Package: 1.56mm Max
• CDMA 1XRTT Compliant
• CDMA 1xEV-DO Compliant