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AB102S-B データシート - Chip Integration Technology Corporation

AB102S-B image

部品番号
AB102S-B

Other PDF
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PDF
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page
4 Pages

File Size
181.4 kB

メーカー
CITC
Chip Integration Technology Corporation CITC

Features
• Glass passivated die construction.
• Low forward voltage drop.
• High current capability.
• High surge current capability.
• Design for surface mount application.
• Plastic material-UL flammability 94V-0.

Mechanical data
• Case : SOPA-4,Molded plastic, ABS
• Terminals :plated leads solderable per
   MIL-STD-202, Method 208
• Polarity : as marked on case
• Mounting position: Any
• Marking: type number


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