General Description
ProASIC3E, the third-generation family of Microsemi flash FPGAs, offers performance, density, and features beyond those of the ProASICPLUS® family. Nonvolatile flash technology gives ProASIC3E devices the advantage of being a secure, low power, single-chip solution that is Instant On. ProASIC3E is reprogrammable and offers time-to-market benefits at an ASIC-level unit cost. These features enable designers to create high-density systems using existing ASIC or FPGA design flows and tools.

FEATUREs and Benefits
High Capacity
    • 600 k to 3 Million System Gates
    • 108 to 504 kbits of True Dual-Port SRAM
    • Up to 620 User I/Os
Reprogrammable Flash Technology
    • 130-nm, 7-Layer Metal (6 Copper), Flash-Based CMOS Process
    • Instant On Level 0 Support
    • Single-Chip Solution
    • Retains Programmed Design when Powered Off
On-Chip User Nonvolatile Memory
    • 1 kbit of FlashROM with Synchronous Interfacing
High Performance
    • 350 MHz System Performance
    • 3.3 V, 66 MHz 64-Bit PCI
In-System Programming (ISP) and Security
    • ISP Using On-Chip 128-Bit Advanced Encryption Standard (AES) Decryption via JTAG (IEEE 1532–compliant)
    • FlashLock® Designed to Secure FPGA Contents
Low Power
    • Core Voltage for Low Power
    • Support for 1.5-V-Only Systems
    • Low-Impedance Flash Switches
High-Performance Routing Hierarchy
    • Segmented, Hierarchical Routing and Clock Structure
    • Ultra-Fast Local and Long-Line Network
    • Enhanced High-Speed, Very-Long-Line Network
    • High-Performance, Low-Skew Global Network
    • Architecture Supports Ultra-High Utilization
Pro (Professional) I/O
    • 700 Mbps DDR, LVDS-Capable I/Os
    • 1.5 V, 1.8 V, 2.5 V, and 3.3 V Mixed-Voltage Operation
    • Bank-Selectable I/O Voltages—up to 8 Banks per Chip
    • Single-Ended I/O Standards: LVTTL, LVCMOS 3.3 V / 2.5 V / 1.8 V / 1.5 V, 3.3 V PCI / 3.3 V PCI-X, and LVCMOS 2.5 V / 5.0 V Input
    • Differential I/O Standards: LVPECL, LVDS, B-LVDS, and M-LVDS
    • Voltage-Referenced I/O Standards: GTL+ 2.5 V / 3.3 V, GTL 2.5 V / 3.3 V, HSTL Class I and II, SSTL2 Class I and II, SSTL3 Class I and II
    • I/O Registers on Input, Output, and Enable Paths
    • Hot-Swappable and Cold Sparing I/Os
    • Programmable Output Slew Rate and Drive Strength
    • Programmable Input Delay
    • Schmitt Trigger Option on Single-Ended Inputs
    • Weak Pull-Up/-Down
    • IEEE 1149.1 (JTAG) Boundary Scan Test
    • Pin-Compatible Packages across the ProASIC®3E Family
Clock Conditioning Circuit (CCC) and PLL
    • Six CCC Blocks, Each with an Integrated PLL
    • Configurable Phase-Shift, Multiply/Divide, Delay Capabilities and External Feedback
    • Wide Input Frequency Range (1.5 MHz to 350 MHz)
SRAMs and FIFOs
    • Variable-Aspect-Ratio 4,608-Bit RAM Blocks (×1, ×2, ×4, ×9, and ×18 organizations available)
    • True Dual-Port SRAM (except ×18)
    • 24 SRAM and FIFO Configurations with Synchronous Operation up to 350 MHz
ARM® Processor Support in ProASIC3E FPGAs
    • M1 ProASIC3E Devices—Cortex-M1 Soft Processor Available with or without Debug