Features
• For surface mount application in order to optimize board space
• Low inductance
• Low profile package
• Built-in strain relief
• Glass passivated junction
• Excellent clamping capability
• Repetition Rate( duty cycle): 0.01%
• Fast response time: typical less than 1ps from 0V to BV min
• Typical ID less than 1uA above 10V
• High temperature soldering: 250oC/10 seconds at terminals
• Plastic package has Underwrites Laboratory Flammability Classification 94V-O
• UL Recognized File # E222849