General Description
Micron NAND Flash devices include an asynchronous data interface for high-perform ance I/O operations. These devices use a highly multiplexed 8-bit bus (DQx) to transfer commands,address, and data. There are five control signals used to implement the asyn chronous data interface: CE#, CLE, ALE, WE#, and RE#. Additional signals control hardware write protection (WP#) and monitor device status (R/B#).

FEATUREs
• Open NAND Flash Interface (ONFI) 2.2-compliant1
• Multiple-level cell (MLC) technology
• Organization
   – Page size x8: 8640 bytes (8192 + 448 bytes)
   – Block size: 256 pages (2048K + 112K bytes)
   – Plane size: 2 planes x 2048 blocks per plane
   – Device size: 64Gb: 4096 blocks;
      128Gb: 8192 blocks;
      256Gb: 16,384 blocks;
      512Gb: 32,786 blocks
• Synchronous I/O performance
   – Up to synchronous timing mode 5
   – Clock rate: 10ns (DDR)
   – Read/write throughput per pin: 200 MT/s
• Asynchronous I/O performance
– Up to asynchronous timing mode 5
–
tRC/tWC: 20ns (MIN)
• Array performance
   – Read page: 50µs (MAX)
   – Program page: 1300µs (TYP)
   – Erase block: 3ms (TYP)
• Operating Voltage Range
   – VCC: 2.7–3.6V
   – VCCQ: 1.7–1.95V, 2.7–3.6V
• Command set: ONFI NAND Flash Protocol
• Advanced Command Set
   – Program cache
   – Read cache sequential
   – Read cache random
   – One-time programmable (OTP) mode
   – Multi-plane commands
   – Multi-LUN operations
   – Read unique ID
   – Copyback
• First block (block address 00h) is valid when shipped
   from factory. For minimum required ECC, see
   Error Management (page 109).
• RESET (FFh) required as first command after power
   on
• Operation status byte provides software method for
   detecting
   – Operation completion
   – Pass/fail condition
   – Write-protect status
• Data strobe (DQS) signals provide a hardware method
   for synchronizing data DQ in the synchronous
   interface
• Copyback operations supported within the plane
   from which data is read
• Quality and reliability
   – Data retention: 10 years
   – Endurance: 5000 PROGRAM/ERASE cycles
• Operating temperature:
   – Commercial: 0°C to +70°C
   – Industrial (IT): –40ºC to +85ºC
• Package
   – 52-pad LGA
   – 48-pin TSOP
   – 100-ball BGA