Features:
• 150 °C TJ operation
• Isolated heatsink
• Low profile, high current package
• Center tap module
• Low forward voltage drop
• High purity, high temperature epoxy encapsulation for enhanced mechanical strength and moisture resistance
• High frequency operation
• Guard ring for enhanced ruggedness and long term reliability
• This is a Pb − Free Device
• All SMC parts are traceable to the wafer lot
• Additional testing can be offered upon request

APPLICATIONs:
• Switching power supply 
• Converters 
• Free-Wheeling diodes 
• Reverse battery protection