FEATURES
● Glass passivated chip junction
● Hyperectifier structure for high reliability
● Cavity-free glass-passivated junction
● 1500 W  peak  pulse  power capability with a
   10/1000 µs waveform, repetitive  rate  (duty
   cycle): 0.01 %
● Excellent clamping capability
● Very fast response time
● Low incremental surge resistance
● Available in uni-directional and bi-directional
● Solder dip 260ºC, 10s
● AEC-Q101 qualified
● Component in accordance to RoHS 2011/65/EU
   and WEEE 2002/96/EC
● Meets MSL level 1, per J-STD-020, LF maximum
   peak of 260º C

TYPICAL APPLICATIONS
   Used  in  sensitive electronics  protection  against  voltage
   transients induced by inductive load  switching  and lighting
   on ICs, MOSFET,  signal  lines of  sensor  units  for  consumer,
   computer, industrial, automotive and telecommunication.