HS45116GM-25 データシートの表示（PDF） - Intersil
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HS45116GM-25 Datasheet PDF : 6 Pages
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HSP45116/883
Burn-in Circuit
PGA
PIN
PIN
NAME
BURN-IN-
SIGNAL
PGA
PIN
PIN
NAME
BURN-IN PGA
SIGNAL PIN
PIN
NAME
D3
IMIN(0)
F4
Q3
ENPHAC
F1
K14
RO(2)
C2
RIN(18)
F9
P5
ENTIREG
F4
L15
RO(3)
D2
RIN(17)
F8
Q4
ENI
F1
J14
RO(4)
E3
RIN(16)
F7
N6 MODPI/2PI F16
J13
RO(5)
C1
RIN(15)
F6
P6
CS
F2
K15
RO(6)
E2
RIN(14)
F5
Q5
CLK
F0
H14
RO(7)
D1
RIN(13)
F4
P7
AD(1)
F4
H13
RO(8)
F3
RIN(12)
F16
N7
AD(0)
F3
G13
RO(9)
F2
RIN(11)
F15
Q6
WR
F1
G15 RO(10)
E1
RIN(10)
F14
P8
C(15)
GND
F15
RO(11)
G2
RIN(9)
F13
N8
C(14)
GND
G14 RO(12)
G3
RIN(8)
F12
N9
C(13)
GND
F14
RO(13)
F1
RIN(7)
F11
Q9
C(12)
GND
F13
RO(14)
H2
RIN(6)
F10
Q10
C(11)
GND
E15 RO(15)
H3
RIN(5)
F9
P9
C(10)
GND
E14 RO(16)
J3
RIN(4)
F8
P10
C(9)
GND
D15 RO(17)
J1
RIN(3)
F7
N10
C(8)
GND
C15 RO(18)
K1
RIN(2)
F6
Q11
C(7)
GND
D14 RO(19)
J2
RIN(1)
F5
P11
C(6)
GND
E13
IO(0)
K2
RIN(0)
F4
Q12
C(5)
GND
C14
IO(1)
K3
SH(1)
F3
Q13
C(4)
GND
B15
IO(2)
L1
SH(0)
F2
P12
C(3)
GND
D13
IO(3)
L2
ACC
F4
N11
C(2)
GND
C13
IO(4)
M1 ENPHREG
F16
P13
C(1)
GND
B14
IO(5)
N1 ENOFREG
F4
M2
PEAK
F8
Q14
C(0)
VCC
C12
IO(6)
N12
OUT-
F11
B13
IO(7)
MUX(1)
L3
RBYTILD
F16
N13
OUT-
F10
MUX(0)
B12
IO(8)
N2
BINFMT
F4
P14
OER
F0
C11
IO(9)
P1
TICO
VCC /2
M13
OEREXT
F0
M3
MOD(1)
GND
N14
OEIEXT
F0
A13
IO(10)
B11
IO(11)
N3
MOD(0)
GND
M14
OEI
F0
A12
IO(12)
P2
PACI
F4
N4
LOAD
F15
P3
PMSEL
F1
P4
CLROFR
F4
N5 ENCFREG
F4
NOTE:
L13
N15
L14
M15
K13
PACO
VCC / 2
C10
IO(13)
DET0
VCC / 2
B10
IO(14)
DET1
VCC / 2
A11
IO(15)
RO(0)
VCC / 2
B9
IO(16)
RO(1)
VCC / 2
C9
IO(17)
11. 47kΩ ±20%) resistor connected to all pins except VCC and GND.
12. VCC = 5.5V ±0.5V with 0.1µF (min) capacitor between VCC and GND per position.
13. F0 = 100kHz ±10%, F1 = F0/2, F2 = F1/2 . . . . . , F11 = F10/2, 40% to 60% duty cycle.
14. Input Voltage limits: VIL = 0.8V max, VIH = 4.5V ±10%.
Die Characteristics
BURN-IN
SIGNAL
VCC /2
VCC /2
VCC /2
VCC /2
VCC /2
VCC /2
VCC /2
VCC /2
VCC /2
VCC /2
VCC /2
VCC /2
VCC /2
VCC /2
VCC /2
VCC /2
VCC /2
VCC /2
VCC /2
VCC /2
VCC /2
VCC /2
VCC /2
VCC /2
VCC /2
VCC /2
VCC /2
VCC /2
VCC /2
VCC /2
VCC /2
VCC /2
VCC /2
VCC /2
VCC /2
VCC /2
DIE DIMENSIONS:
350 mils x 353 mils x 19 ± 1mils
METALLIZATION:
Type: Si-Al, or Si-Al-Cu
Thickness: 8kÅ
GLASSIVATION:
Type: Nitrox
Thickness: 10kÅ
WORST CASE DENSITY:
1.6 x 105A/cm2
PGA
PIN
A10
B8
C8
C7
A7
A6
B7
B6
C6
A5
B5
A4
A3
B4
C5
B3
A2
C4
C3
B2
A1
A9
A15
G1
J15
Q1
Q7
Q15
A8
A14
B1
H1
H15
P15
Q2
Q8
PIN
NAME
IO(18)
IO(19)
IMIN(18)
IMIN(17)
IMIN(16)
IMIN(15)
IMIN(14)
IMIN(13)
IMIN(12
IMIN(11)
IMIN(10)
IMIN(9)
IMIN(8)
IMIN(7)
IMIN(6)
IMIN(5)
IMIN(4)
IMIN(3)
IMIN(2)
IMIN(1)
VC
VCC
VCC
VCC
VCC
VCC
BURN-IN
SIGNAL
VCC / 2
VCC / 2
F9
F8
F7
F6
F5
F4
F16
F15
F14
F13
F12
F11
F10
F9
F8
F7
F6
F5
None
VCC
None
VCC
VCC
None
VCC
VCC
VCC
GND
GND
GND
GND
GND
GND
GND
GND
None
GND
None
None
GND
GND
None
None
GND
6
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