NCV8660C データシートの表示（PDF） - ON Semiconductor
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NCV8660C Datasheet PDF : 11 Pages
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NCV8660C
150
140
130
120
110
100
90
80
0
100
50% Duty Cycle
10
20%
10%
5%
1
Single Pulse
1% 2%
0.1
Power curve with PCB 1 oz cu
ThetaJA curve
100 200 300 400 500 600
COPPER HEAT SPREADER AREA (mm2)
Figure 20. RqJA vs. PCB Copper Area
(SOIC−8 Fused)
1.4
1.3
1.2
1.1
1.0
0.9
0.8
0.7
0.6
700
0.01
0.001
0.000001 0.00001
0.0001
0.001
0.01
0.1
PULSE TIME (sec)
1
10
Figure 21. Transient Thermal Response (SOIC−8 Fused)
Cu Area = 645 mm2
100
1000
ORDERING INFORMATION
Device
Output Voltage
Reset Delay Time,
DT to GND
Reset Delay Time,
DT to OUT
Package
Shipping†
NCV86601CD50R2G
5.0 V
8 ms
128 ms
SOIC−8 FUSED 2500 / Tape & Reel
(Pb−Free)
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specification Brochure, BRD8011/D.
www.onsemi.com
10
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