MMBT5550L データシートの表示（PDF） - ON Semiconductor
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MMBT5550L Datasheet PDF : 6 Pages
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MMBT5550L, MMBT5551L
High Voltage Transistors
NPN Silicon
Features
• S Prefix for Automotive and Other Applications Requiring Unique
Site and Control Change Requirements; AEC−Q101 Qualified and
PPAP Capable
• These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS
Compliant
MAXIMUM RATINGS
Rating
Symbol Value
Unit
Collector −Emitter Voltage
VCEO
Vdc
MMBT5550
140
MMBT5551
160
Collector −Base Voltage
VCBO
Vdc
MMBT5550
160
MMBT5551
180
Emitter −Base Voltage
Collector Current − Continuous
Electrostatic Discharge
Human Body Model
Machine Model
VEBO
IC
ESD
6.0
600
> 8000
> 400
Vdc
mAdc
V
THERMAL CHARACTERISTICS
Characteristic
Symbol
Max
Unit
Total Device Dissipation FR− 5 Board
PD
(Note 1) @TA = 25°C
Derate Above 25°C
225
mW
1.8
mW/°C
Thermal Resistance, Junction−to−Ambient
Total Device Dissipation Alumina
Substrate (Note 2) @TA = 25°C
Derate Above 25°C
RqJA
PD
556
°C/W
300
mW
2.4
mW/°C
Thermal Resistance, Junction−to−Ambient RqJA
417
°C/W
Junction and Storage Temperature
TJ, Tstg −55 to +150 °C
Stresses exceeding those listed in the Maximum Ratings table may damage the
device. If any of these limits are exceeded, device functionality should not be
assumed, damage may occur and reliability may be affected.
1. FR− 5 = 1.0 0.75 0.062 in.
2. Alumina = 0.4 0.3 0.024 in. 99.5% alumina.
www.onsemi.com
COLLECTOR
3
1
BASE
2
EMITTER
3
1
2
SOT−23 (TO−236)
CASE 318
STYLE 6
MARKING
DIAGRAM
x1x M G
G
1
x1x = Device Code
M1F = MMBT5550LT
G1 = MMBT5551LT
M = Date Code*
G = Pb−Free Package
(Note: Microdot may be in either location)
*Date Code orientation and/or overbar may
vary depending upon manufacturing location.
ORDERING INFORMATION
Device
Package
Shipping†
MMBT5550LT1G SOT−23
(Pb−Free)
3,000 / Tape &
Reel
MMBT5550LT3G SOT−23 10,000 / Tape &
(Pb−Free)
Reel
MMBT5551LT1G SOT−23
(Pb−Free)
3,000 / Tape &
Reel
SMMBT5551LT1G SOT−23 3,000 / Tape & Reel
(Pb−Free)
MMBT5551LT3G SOT−23 10,000 / Tape &
(Pb−Free)
Reel
SMMBT5551LT3G SOT−23 10,000 / Tape &
(Pb−Free)
Reel
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
© Semiconductor Components Industries, LLC, 1994
1
October, 2016 − Rev. 12
Publication Order Number:
MMBT5550LT1/D
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