MMBT1010LT1 データシートの表示（PDF） - ON Semiconductor
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MMBT1010LT1 Datasheet PDF : 8 Pages
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MMBT1010LT1 MSD1010T1
MINIMUM RECOMMENDED FOOTPRINT FOR SURFACE MOUNTED APPLICATIONS
Surface mount board layout is a critical portion of the total
design. The footprint for the semiconductor packages must
be the correct size to insure proper solder connection
interface between the board and the package. With the
correct pad geometry, the packages will self align when
subjected
to
a
solder
reflow
process.
0.037
0.95
0.037
0.95
0.037
0.95
0.037
0.95
0.039
1.0
0.031
0.8
0.098Ć0.118
2.5Ć3.0
0.094
2.4
inches
mm
0.035
0.9
0.079
2.0
0.031
0.8
inches
mm
SC–59
SOT–23
SC-59/SOT-23 POWER DISSIPATION
The power dissipation of the SC-59/SOT-23 is a function the equation for an ambient temperature TA of 25°C, one can
of the drain pad size. This can vary from the minimum pad calculate the power dissipation of the device which in this
size for soldering to the pad size given for maximum power case is 225 milliwatts.
dissipation. Power dissipation for a surface mount device is
determined by TJ(max), the maximum rated junction
temperature of the die, RθJA, the thermal resistance from the
device junction to ambient; and the operating temperature,
PD =
150°C – 25°C
556°C/W
= 225 milliwatts
The 556°C/W assumes the use of the recommended
TA. Using the values provided on the data sheet, PD can be
calculated as follows.
footprint on a glass epoxy printed circuit board to achieve a
power dissipation of 225 milliwatts. Another alternative
PD =
TJ(max) – TA
RθJA
would be to use a ceramic substrate or an aluminum core
board such as Thermal Clad™. Using a board material such
as Thermal Clad, the power dissipation can be doubled
The values for the equation are found in the maximum using the same footprint.
ratings table on the data sheet. Substituting these values into
SOLDERING PRECAUTIONS
The melting temperature of solder is higher than the rated • The soldering temperature and time should not exceed
temperature of the device. When the entire device is heated 260°C for more than 10 seconds.
to a high temperature, failure to complete soldering within
a short time could result in device failure. Therefore, the
following items should always be observed in order to
minimize the thermal stress to which the devices are
subjected.
• Always preheat the device.
• The delta temperature between the preheat and soldering
should be 100°C or less.*
• When preheating and soldering, the temperature of the
leads and the case must not exceed the maximum
• When shifting from preheating to soldering, the maximum
temperature gradient should be 5°C or less.
• After soldering has been completed, the device should be
allowed to cool naturally for at least three minutes.
Gradual cooling should be used as the use of forced
cooling will increase the temperature gradient and result
in latent failure due to mechanical stress.
• Mechanical stress or shock should not be applied during
cooling
* Soldering a device without preheating can cause
temperature ratings as shown on the data sheet. When
excessive thermal shock and stress which can result in
using infrared heating with the reflow soldering method,
the difference should be a maximum of 10°C.
damage to the device.
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