LT3008
PACKAGE DESCRIPTION
DC Package
6-Lead Plastic DFN (2mm × 2mm)
(Reference LTC DWG # 05-08-1703)
2.50 p 0.05
0.61 p 0.05
1.15 p 0.05 (2 SIDES)
0.675 p 0.05
PACKAGE PIN 1 BAR
OUTLINE TOP MARK
(SEE NOTE 6)
0.25 p 0.05
0.50 BSC
1.42 p 0.05
(2 SIDES)
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
0.200 REF
NOTE:
1. DRAWING TO BE MADE A JEDEC PACKAGE OUTLINE M0-229 VARIATION OF (WCCD-2)
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE
R = 0.115
TYP
0.56 p 0.05
4
(2 SIDES)
0.38 p 0.05
6
2.00 p 0.10
(4 SIDES)
0.75 p 0.05
0.00 – 0.05
PIN 1
CHAMFER OF
EXPOSED PAD
3
1
(DC6) DFN 1103
0.25 p 0.05
0.50 BSC
1.37 p 0.05
(2 SIDES)
BOTTOM VIEW—EXPOSED PAD
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION ON THE
TOP AND BOTTOM OF PACKAGE
3008f
14