EUA6011AQIT1 データシートの表示（PDF） - Eutech Microelectronics Inc

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EUA6011AQIT1

3-W Stereo Audio Power Amplifier with Advanced DC Volume Control

Eutech Microelectronics Inc 

Thermal Pad Considerations

The thermal pad must be connected to ground. The

package with thermal pad of the EUA6011A requires

special attention on thermal design. If the thermal

design issues are not properly addressed, the

EUA6011A will go into thermal shutdown when driving

a heavy load.

The thermal pad on the bottom of the EUA6011A

should be soldered down to a copper pad on the circuit

board. Heat can be conducted away from the thermal

pad through the copper plane to ambient. If the copper

plane is not on the top surface of the circuit board, 8 to

10 vias of 13 mil or smaller in diameter should be used

to thermally couple the thermal pad to the bottom plane.

For good thermal conduction, the vias must be plated

through and solder filled. The copper plane used to

conduct heat away from the thermal pad should be as

large as practical.

If the ambient temperature is higher than 25℃,a larger

copper plane or forced-air cooling will be required to

keep the EUA6011A junction temperature below the

thermal shutdown temperature (150℃). In higher

ambient temperature, higher airflow rate and/or larger

copper area will be required to keep the IC out of

thermal shutdown.

EUA6011A

DS6011A Ver 1.0 Mar. 2006

19

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