UPD72874 データシートの表示（PDF） - NEC => Renesas Technology

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UPD72874

IEEE1394 OHCI 1.1 COMPLIANT 3PORT PHY-LINK 1-CHIP HOST CONTROLLER

NEC => Renesas Technology 

µPD72874

7. RECOMMENDED SOLDERING CONDITIONS

The µPD72874 should be soldered and mounted under the following recommended conditions.

For the details of the recommended soldering conditions, refer to the document Semiconductor Device Mounting

Technology Manual (C10535E).

For soldering methods and conditions other than those recommended below, contact your NEC sales

representative.

Table 7-1. Surface Mounting Type Soldering Conditions

µPD72874GC-YEB: 120-pin plastic TQFP (Fine pitch) (14 x 14)

Soldering

Method

Soldering Conditions

Recommended

Condition Symbol

Infrared reflow

Package peak temperature: 235°C, Time: 30 sec. Max. (at 210°C or higher).

Count: three times or less

Exposure limit: 3 daysNote (after that prebake at 125°C for 10 hours)

IR35-103-3

Partial heating Pin temperature: 300°C Max., Time: 3 sec. Max. (per pin row)

—

Note After opening the dry pack, store it at 25°C or less and 65% RH or less for the allowable storage period.

Preliminary Data Sheet S15306EJ2V0DS

35

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