UPD72862 データシートの表示（PDF） - NEC => Renesas Technology

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UPD72862

IEEE1394 OHCI HOST CONTROLLER

NEC => Renesas Technology 

µPD72862

5 7. RECOMMENDED SOLDERING CONDITIONS

The µPD72850A should be soldered and mounted under the following recommended conditions.

For the details of the recommended soldering conditions, refer to the document Semiconductor Device Mounting

Technology Manual (C10535E).

For soldering methods and conditions other than those recommended below, contact your NEC sales

representative.

Table 7-1. Surface Mounting Type Soldering Conditions

µPD72862GC-9EU : 100-pin plastic TQFP (Fine pitch) (14 x 14)

Soldering

Soldering Conditions

Method

Recommended

Condition Symbol

Infrared reflow

Package peak temperature: 235°C, Time: 30 sec. Max. (at 210°C or higher).

Count: three times or less

Exposure limit: 3 daysNote (after that prebake at 125°C for 10 hours)

IR35-103-3

VPS

Package peak temperature: 215°C, Time: 40 sec. Max. (at 200°C or higher).

Count: three times or less

Exposure limit: 3 daysNote (after that prebake at 125°C for 10 hours)

VP15-103-3

Partial heating Pin temperature: 300°C Max., Time: 3 sec. Max. (per pin row)

—

Note After opening the dry pack, store it at 25°C or less and 65% RH or less for the allowable storage period.

Caution Do not use different soldering methods together (except for partial heating).

32

Data Sheet S14265EJ2V0DS00

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