TEMD5020 データシートの表示（PDF） - Vishay Semiconductors
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TEMD5020 Datasheet PDF : 8 Pages
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TEMD5020
Vishay Semiconductors
Reflow Solder Profiles
Preheat
Reflow
Cooling
280
260
240
260 °C 250 °C
220
200
210 °C
180
160
140
120 125 °C
145 °C
100
~ 20s
80
60
~ 30 s
40
120 s
~ 40 s
20
0
0 30 60 90 120 150 180 210 240 270 300
19030
Time (s)
Figure 8. Lead-Free (Sn) Reflow Solder Profile
Drying
In case of moisture absorption devices should be
baked before soldering. Conditions see J-STD-020 or
Label. Devices taped on reel dry using recommended
conditions 192 h @ 40 °C (+ 5 °C), RH < 5 % or 96 h
@ 60 °C (+ 5 °C), RH < 5 %
300
max. 240°C ca. 230 °C
250
10 s
94 8625
200
150
100
50
0
0
215 ° C
max. 160 °C
90 s - 120 s
max 40 s
Lead Temperature
2 K/s - 4 K/s
full line : typical
dotted line : process limits
50
100
150
200
250
Time (s)
Figure 9. Lead Tin (SnPb) Reflow Solder Profile
Drypack
Devices are packed in moisture barrier bags (MBB) to
prevent the products from moisture absorption during
transportation and storage. Each bag contains a des-
iccant.
Floor Life
Floor life (time between soldering and removing from
MBB) must not exceed the time indicated in
J-STD-020. TEMD5110 is released for:
Moisture Sensitivity Level 4, according to
JEDEC, J-STD-020
Floor Life: 72 h
Conditions: Tamb < 30 °C, RH < 60 %
www.vishay.com
6
Document Number 84685
Rev. 1.2, 12-Aug-05
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