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IRF234 データシートの表示(PDF) - Intersil

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IRF234 Datasheet PDF : 7 Pages
1 2 3 4 5 6 7
IRF234, IRF235, IRF236, IRF237
Electrical Specifications TC = 25oC, Unless Otherwise Specified (Continued)
PARAMETER
SYMBOL
TEST CONDITIONS
MIN TYP MAX UNITS
Input Capacitance
Output Capacitance
Reverse Transfer Capacitance
Internal Drain Inductance
Internal Source Inductance
Therma Resistance Junction to Case
Therma Resistance Junction to Ambient
CISS VGS = 0V, VDS = 25V, f = 1.0MHz, (Figure 11) -
COSS
-
CRSS
-
LD Measured Between the Modified MOSFET
-
Contact Screw on the Symbol Showing the
Flange that is Closer to Internal Devices
Source and Gate Pins Inductances
and the Center of Die
D
LS Measured From The
Source Lead, 6mm
(0.25in) From the Flange G
and the Source Bonding
Pad
LD
-
LS
S
RθJC
-
RθJA Free Air Operation
-
600 -
pF
180 -
pF
52
-
pF
5.0 -
nH
12.5 -
nH
- 1.67 oC/W
-
30 oC/W
Source to Drain Diode Specifications
PARAMETER
Continuous Source to Drain Current
Pulse Source to Drain Current
(Note 3)
SYMBOL
TEST CONDITIONS
IS
Modified MOSFET
Symbol Showing the
D
ISDM Integral Reverse
P-N Junction Diode
G
MIN TYP MAX UNITS
-
-
8.1
A
-
-
32
A
S
Source to Drain Diode Voltage (Note 2)
Reverse Recovery Time
Reverse Recovered Charge
VSD
TJ = 25oC, ISD = 8.1A, VGS = 0V, (Figure 13) -
-
2.0
V
trr
TJ = 25oC, ISD = 8.1A, dISD/dt = 100A/µs
92 180 390 ns
QRR
TJ = 25oC, ISD = 8.1A, dISD/dt = 100A/µs
0.63 1.3 2.7 µC
NOTES:
2. Pulse test: pulse width 300µs, duty cycle 2%.
3. Repetitive rating: pulse width limited by Max junction temperature. See Transient Thermal Impedance curve (Figure 3).
4. VDD = 50V, starting TJ = 25oC, L = 4.5mH, RG = 25, peak IAS = 8.1A. See Figures 15, 16.
5-3

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