NB100LVEP56
Table 1. PIN FUNCTION DESCRIPTION
Pin No.
ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ TSSOP
QFN
Name
I/O
14,20 3,9,18,19,
VCC
−
20
Default
State
−
Description
Positive Supply Voltage. All VCC Pins must be Externally
Connected to Power Supply to Guarantee Proper Operation.
11
15,24
VEE
−
−
Negative Supply Voltage. All VEE Pins must be Externally
Connected to Power Supply to Guarantee Proper Operation.
3,8
6,12
VBB0,
−
VBB1
−
ECL Reference Voltage Output
1
4
D0a
ECL Input
Low
Noninverted Differential Data a Input to MUX 0. Internal 75 kW to
VEE.
2
5
D0a
ECL Input
High
Inverted Differential Data a Input to MUX 0. Internal 75 kW to VEE
and 37 kW to VCC.
4
7
D0b
ECL Input
Low
Noninverted Differential Data b Input to MUX 0. Internal 75 kW to
VEE.
5
8
D0b
ECL Input
High
Inverted Differential Data b Input to MUX 0. Internal 75 kW to VEE
and 37 kW to VCC.
6
10
D1a
ECL Input
Low
Noninverted Differential Data a Input to MUX 1. Internal 75 kW to
VEE.
7
11
D1a
ECL Input
High
Inverted Differential Data a Input to MUX 1. Internal 75 kW to VEE
and 37 kW to VCC.
9
13
D1b
ECL Input
Low
Noninverted Differential Data b Input to MUX 1. Internal 75 kW to
VEE.
10
14
D1b
ECL Input
High
Inverted Differential Data b Input to MUX 1. Internal 75 kW to VEE
and 37 kW to VCC.
19
2
Q0
ECL Output
−
Noninverted Differential Output MUX 0. Typically Terminated with
50 W to VTT = VCC − 2.0 V.
18
1
Q0
ECL Output
−
Inverted Differential Output MUX 0. Typically Terminated with
50 W to VTT = VCC − 2.0 V.
13
17
Q1
ECL Output
−
Noninverted Differential Output MUX 1. Typically Terminated with
50 W to VTT = VCC − 2.0 V.
12
16
Q1
ECL Output
−
Inverted Differential Output MUX 1. Typically Terminated with
50 W to VTT = VCC − 2.0 V.
17
23
SEL0
ECL, CMOS
Low
Noninverted Differential Select Input to MUX 0. Internal 75 W to
Input
VEE.
16
22
COM_SEL ECL, CMOS
Low
Noninverted Differential Common Select Input to Both MUX.
Input
Internal 75 W to VEE.
15
21
SEL1
ECL, CMOS
Low
Noninverted Differential Select Input to MUX 1. Internal 75 W to
Input
VEE.
N/A
−
EP
−
Exposed Pad. (Note 1)
1. The thermally conductive exposed pad on the package bottom (see case drawing) must be attached to a heat sinking conduit.
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2