MC74HC74AFL1 データシートの表示（PDF） - ON Semiconductor

部品番号

コンポーネント説明

一致するリスト

MC74HC74AFL1

Dual D Flip−Flop with Set and Reset

ON Semiconductor 

MC74HC74A

PIN ASSIGNMENT

LOGIC DIAGRAM

RESET 1 1

DATA 1 2

CLOCK 1 3

SET 1 4

Q1 5

Q1 6

GND 7

14 VCC

13 RESET 2

12 DATA 2

11 CLOCK 2

10 SET 2

9 Q2

8 Q2

FUNCTION TABLE

Inputs

Set Reset Clock Data

LH

HL

LL

HH

HH

HH

HH

HH

XX

XX

XX

H

L

LX

HX

X

Outputs

QQ

HL

LH

H* H*

HL

LH

No Change

No Change

No Change

RESET 1 1

DATA 1 2

3

CLOCK 1

SET 1 4

13

RESET 2

DATA 2 12

11

CLOCK 2

10

SET 2

5

Q1

6

Q1

9

Q2

8

Q2

PIN 14 = VCC

PIN 7 = GND

*Both outputs will remain high as long as Set and Reset are low, but the output

states are unpredictable if Set and Reset go high simultaneously.

MAXIMUM RATINGS

ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ Symbol

Parameter

Value

Unit

ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ VCC DC Supply Voltage (Referenced to GND)

– 0.5 to + 7.0

V

ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ Vin DC Input Voltage (Referenced to GND)

– 0.5 to VCC + 0.5 V

ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ Vout DC Output Voltage (Referenced to GND)

– 0.5 to VCC + 0.5 V

ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ Iin

DC Input Current, per Pin

± 20

mA

Iout DC Output Current, per Pin

± 25

mA

ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ICC DC Supply Current, VCC and GND Pins

± 50

mA

ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ PD Power Dissipation in Still Air,

Plastic DIP†

750

mW

ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ SOIC Package†

500

TSSOP Package†

450

ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ Tstg Storage Temperature

– 65 to + 150

_C

ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ TL Lead Temperature, 1 mm from Case for 10 Seconds

_C

ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ (Plastic DIP, SOIC or TSSOP Package)

260

ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ 300

ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress

ratings only. Functional operation above the Recommended Operating Conditions is not implied.

Extended exposure to stresses above the Recommended Operating Conditions may affect device

reliability.

†Derating — Plastic DIP: – 10 mW/_C from 65_ to 125_C

SOIC Package: – 7 mW/_C from 65_ to 125_C

TSSOP Package: − 6.1 mW/_C from 65_ to 125_C

RECOMMENDED OPERATING CONDITIONS

ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ Symbol

Parameter

Min

ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ VCC

ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ Vin, Vout

ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ TA

ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ tr, tf

DC Supply Voltage (Referenced to GND)

DC Input Voltage, Output Voltage (Referenced to GND)

Operating Temperature, All Package Types

Input Rise and Fall Time

(Figures 1, 2, 3)

VCC = 2.0 V

VCC = 3.0 V

VCC = 4.5 V

VCC = 6.0 V

2.0

0

– 55

0

0

0

0

Max Unit

6.0

V

VCC

V

+ 125 _C

1000 ns

600

500

400

This device contains protection

circuitry to guard against damage

due to high static voltages or electric

fields. However, precautions must

be taken to avoid applications of any

voltage higher than maximum rated

voltages to this high−impedance cir-

cuit. For proper operation, Vin and

Vout should be constrained to the

range GND v (Vin or Vout) v VCC.

Unused inputs must always be

tied to an appropriate logic voltage

level (e.g., either GND or VCC).

Unused outputs must be left open.

http://onsemi.com

2

Share Link: