MAAP-000077-MCH000 データシートの表示（PDF） - Tyco Electronics
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MAAP-000077-MCH000 Datasheet PDF : 8 Pages
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Amplifier, Power, 13W
0.7-2.5 GHz
Mechanical Information
MAAP-000077-PED000
Rev —
Preliminary Datasheet
Chip edge to bond pad dimensions are shown to the center of the bond pad.
Bond Pad Dimensions
Figure 18. Die Layout
Pad
RF In and Out
DC Drain Supply Voltage VD1
DC Drain Supply Voltage VD2
DC Gate Supply Voltage VG1
DC Gate Supply Voltage VG2
Pad No.
1
2
3
4
5
Size (μm)
100 x 200
200 x 150
500 x 200
150 x 150
150 x 125
Size (mils)
4x8
8x6
20 x 8
6x6
6x5
6
M/A-COM Inc. and its affiliates reserve the right to make changes to the
product(s) or information contained herein without notice. M/A-COM makes
no warranty, representation or guarantee regarding the suitability of its
products for any particular purpose, nor does M/A-COM assume any liability
whatsoever arising out of the use or application of any product(s) or
information.
• North America Tel: 800.366.2266 / Fax: 978.366.2266
• Europe Tel: 44.1908.574.200 / Fax: 44.1908.574.300
• Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298
Visit www.macom.com for additional data sheets and product information.
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