EL7560 データシートの表示（PDF） - Intersil
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EL7560 Datasheet PDF : 7 Pages
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EL7560
EL7560 Functional Block Diagram
VID [0:3], Pin
15,16,17,18
CREF, Pin 27
CSLOPE, Pin 26
DAC
To VOUT FB, Pin 28
-
VDD
+
ISLOPE
+
-
Σ
Cp-, Pin 1
Cp+, Pin 2
PWRGD, Pin 12
V2X
-
+
LEB TDELAY
C2V, Pin 3
VDD and VIN,
Pin 21,23,24
VHI, Pin 5
4V
UVLO
VDD
COSC, Pin 25
OUTEN, Pin 14
-
S
+
-
R
+
-
+
VDD
RSS
CSS
Q
R
Q
S
FF
R
S
Zero Cross Detect
LX,
Pin 6,7,8,9,10
VSSP, Pin
19,20,21
Over Temp Sensor
OT, Pin 13
VSS, Pin 4
Thermal considerations and power dissipation:
To achieve the maximum 12.4A continuous output current,
the EL7560 is packaged in a 28 pin HSOP (Heat-Slug SO
Package). Within the package, the EL7560 die is attached to
one side of a copper slug. The other side of the slug is
coincident with the package top surface, and is therefore
exposed to the ambient environment. The copper slug
provides an exceptionally low thermal resistance (θJC) of
typically 7°C/W. To obtain low junction to ambient thermal
resistance (θJA), a heatsink is required to provide heat
transfer path from the die to the ambient. The EL7560 power
dissipation is a direct function of the “on” resistance of the
internal power FETs (Rds-on) and the output current. For the
maximum 12.4A output current and the worse case Rds-on
at 125°C (35mΩ), the power dissipation is Iout2*R = 5.38W.
To maintain 12.4A continuous output current operation at the
maximum 70°C ambient temperature, the die temperature
must be kept below the 135°C thermal shut down
temperature. This requires a θJA of 12°C/W. To help achieve
such a low θJA with practical size heatsink, airflow is also
required. Application note #13 shows the 11°C/W thermal
resistance can be achieved with the Wakefield heatsink
#8052-60 and minimum 200LFM airflow.
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notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and
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