DIM200PHM33-F000(2004) データシートの表示（PDF） - Dynex Semiconductor

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DIM200PHM33-F000
(Rev.:2004)

Half Bridge IGBT Module

Dynex Semiconductor 

DIM200PHM33-F000

PACKAGE DETAILS

For further package information, please visit our website or contact Customer Services. All dimensions in mm, unless stated otherwise.

DO NOT SCALE.

1(E1/C2)

2(C1)

5(E1)

4(G1)

8(C1)

3(E2)

7(E2)

6(G2)

Nominal weight: 750g

Module outline type code: P

Fig. 11 Package details

8/9

Caution: This device is sensitive to electrostatic discharge. Users should follow ESD handling procedures.

www.dynexsemi.com

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