CY7C1339B-166 データシートの表示（PDF） - Cypress Semiconductor
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CY7C1339B-166 Datasheet PDF : 17 Pages
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CY7C1339B
Capacitance[9]
Parameter
Description
Test Conditions
TQFP Max.
BGA Max.
Unit
CIN
CCLK
CI/O
Input Capacitance
TA = 25°C, f = 1 MHz,
4
Clock Input Capacitance
VDD = 3.3V
VDDQ = 3.3V
4
Input/Output Capacitance
4
6
pF
6
pF
8
pF
AC Test Loads and Waveforms
OUTPUT
Z0 = 50Ω
3.3/2.5V
OUTPUT
RL = 50Ω
5 pF
VL = 1.5V for 3.3 VDDQ
1.25V for 2.5V VDDQ
(a)
INCLUDING
JIG AND
SCOPE
R= 317/1667Ω
3.0/2.5V
GND
10%
R= 351/1538Ω ≤ 1V/ns
ALL INPUT PULSES[10]
90%
90%
10%
≤ 1V/ns
(b)
(c)
Thermal Resistance[9]
Description
Test Conditions
Symbol
Thermal Resistance
(Junction to Ambient)
Still Air, soldered on a 4 × 4.5 inch,
QJA
2-layer printed circuit board
Thermal Resistance
QJC
(Junction to Case)
Note:
9. Tested initially and after any design or process changes that may affect these parameters.
10. Input waveform should have a slew rate of 1 V/ns.
TQFP Typ.
41.83
9.99
BGA
47.63
11.71
Units
°C/W
°C/W
Document #: 38-05141 Rev. *A
Page 9 of 17
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