BSP16T1(2004) データシートの表示（PDF） - ON Semiconductor
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BSP16T1 Datasheet PDF : 4 Pages
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BSP16T1
PACKAGE DIMENSIONS
TO−223 (TO−261)
CASE 318E−04
ISSUE K
A
F
4
S
B
1
2
3
L
G
0.08 (0003)
H
D
J
C
M
K
SOLDERING FOOTPRINT*
3.8
0.15
2.0
0.079
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
INCHES
DIM MIN MAX
A 0.249 0.263
B 0.130 0.145
C 0.060 0.068
D 0.024 0.035
F 0.115 0.126
G 0.087 0.094
H 0.0008 0.0040
J 0.009 0.014
K 0.060 0.078
L 0.033 0.041
M
0_ 10 _
S 0.264 0.287
MILLIMETERS
MIN MAX
6.30 6.70
3.30 3.70
1.50 1.75
0.60 0.89
2.90 3.20
2.20 2.40
0.020 0.100
0.24 0.35
1.50 2.00
0.85 1.05
0 _ 10 _
6.70 7.30
STYLE 1:
PIN 1.
2.
3.
4.
BASE
COLLECTOR
EMITTER
COLLECTOR
2.3
0.091
2.3
0.091
6.3
0.248
2.0
0.079
1.5
0.059
ǒ Ǔ SCALE 6:1
mm
inches
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
http://onsemi.com
3
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