ADN4665 データシートの表示（PDF） - Analog Devices

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ADN4665

3 V, LVDS, Quad, CMOS Differential Line Driver

Analog Devices 

ADN4665

OUTLINE DIMENSIONS

10.00 (0.3937)

9.80 (0.3858)

16

4.00 (0.1575)

3.80 (0.1496) 1

9 6.20 (0.2441)

8 5.80 (0.2283)

0.25 (0.0098)

0.10 (0.0039)

COPLANARITY

0.10

1.27 (0.0500)

BSC

0.51 (0.0201)

0.31 (0.0122)

1.75 (0.0689)

1.35 (0.0531)

8°

0°

SEATING

PLANE

0.25 (0.0098)

0.17 (0.0067)

0.50 (0.0197) 45°

0.25 (0.0098)

1.27 (0.0500)

0.40 (0.0157)

COMPLIANT TO JEDEC STANDARDS MS-012-AC

CONTROLLING DIMENSIONS ARE IN MILLIMETERS; INCH DIMENSIONS

(IN PARENTHESES) ARE ROUNDED-OFF MILLIMETER EQUIVALENTS FOR

REFERENCE ONLY AND ARE NOT APPROPRIATE FOR USE IN DESIGN.

Figure 11. 16-Lead Standard Small Outline Package [SOIC_N]

Narrow Body

(R-16)

Dimensions shown in millimeters and (inches)

ORDERING GUIDE

Model

ADN4665ARZ1

ADN4665ARZ-REEL71

ADN4665ARUZ1

ADN4665ARUZ-REEL71

1 Z = RoHS Compliant Part.

5.10

5.00

4.90

16

9

4.50

4.40

4.30

1

6.40

BSC

8

PIN 1

1.20

0.15

MAX

0.20

0.05

0.09

0.75

0.30

8°

0.60

0.65

BSC

0.19 SEATING

PLANE

0°

0.45

COPLANARITY

0.10

COMPLIANT TO JEDEC STANDARDS MO-153-AB

Figure 12. 16-Lead Thin Shrink Small Outline Package [TSSOP]

(RU-16)

Dimensions shown in millimeters

Temperature Range

−40°C to +85°C

−40°C to +85°C

−40°C to +85°C

−40°C to +85°C

Package Description

16-Lead Standard Small Outline Package [SOIC_N]

16-Lead Standard Small Outline Package [SOIC_N]

16-Lead Thin Shrink Small Outline Package [TSSOP]

16-Lead Thin Shrink Small Outline Package [TSSOP]

Package Option

R-16

R-16

RU-16

RU-16

Rev. 0 | Page 10 of 12

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