A3908 データシートの表示（PDF） - Allegro MicroSystems
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A3908 Datasheet PDF : 8 Pages
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A3908
Low Voltage DC Motor Driver
Application Information
Layout
The printed circuit board should use a heavy ground-
plane for optimum thermal performance. The A3908
must be soldered directly onto the board. On the
underside of the A3908 package is an exposed pad,
which provides a path for enhanced thermal dissipa-
tion. The thermal pad should be soldered directly to an
exposed surface on the PCB. Thermal vias are used to
transfer heat to other layers of the PCB. Thermal vias
should not have any thermal relief and should be con-
nected to internal layers, if available, to maximize the
dissipation area.
Grounding In order to minimize the effects of ground
bounce and offset issues, it is important to have a
low impedance, single-point ground, known as a star
ground, located very close to the device. By making
the connection between the exposed thermal pad and
the groundplane directly under the A3908, that area
becomes an ideal location for a star ground point. A
low impedance ground will prevent ground bounce
OUTB
GND
VDD
OUTA
CVDD
GND
U1
IN2
IN1
R2 R1
GND
CVDD
10 MF
A3908 Evaluation Board
OUTB
GND
VDD
OUTA
A3908
PAD
IN2
IN1
VREF
VSET
R1
R2
Allegro MicroSystems, Inc.
6
115 Northeast Cutoff
Worcester, Massachusetts 01615-0036 U.S.A.
1.508.853.5000; www.allegromicro.com
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