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PXA320 データシート - Marvell Semiconductor

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PXA320

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Marvell
Marvell Semiconductor Marvell

MarvellPXA320 Processor Series
Cost-Effective, Scalable Performance up to 806 MHz for Power-Efficient, High-End Multimedia Handsets, Embedded Solutions, and Enterprise-Class Devices

PRODUCT OVERVIEW
Leading the Marvell® PXA3xx processor family, the PXA320 processor, with scalable performance to 806 MHz, plus additional industry-leading processing features, enables outstanding compute and video performance for high-end, multimedia cell phones and PDAs, industrial embedded solutions, and enterprise-class devices. Built on a low-power 90 nanometer (nm) process technology, and with the ability to dynamically scale voltage and frequency on demand, the PXA320 supports today’s stringent requirements for longer battery life. 


KEY FEATURES AND PLATFORM BENEFITS
The PXA320 processor integrates the following features:
•Scalable, general-purpose processing up to 806 MHz, a 256 KB L2 cache, and a 32-bit DDR memory interface for richer end-user applications, such as browsing rich Web2.0 content or streaming video. Extended headroom allows for execution of multiple applications at the same time, which is a key requirement for today’s wireless client devices with advanced capabilities.
•Marvell® Scalable Power Manager technology for MIPS/mW power efficiency, delivering long battery life and enabling consumers to spend more time enjoying the rich features their devices and service providers offer.
•Intel®Wireless MMX™ 2 technology, a 2D graphics accelerator, and a 768 KB frame buffer designed to support VGA resolution streaming video enhance the user’s experience of popular usage models like video playback, video conferencing, camcorder functionality, video telephony, and digital TV.
•An enhanced set of peripherals eases connectivity to technologies like Wi-Fi, WiBro, WiMAX, and Bluetooth v1.2, and the Quick Capture interface supports camera sensors up to 2–3 megapixels (MP) for richer camera applications.
•Package options of a discrete 14x14 mm package and a 15x15 mm package-on-package (PoP) package with stacked NAND flash and mobile DDR memory enable sleek form-factors.

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