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CSPST08-560F データシート - California Micro Devices => Onsemi

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部品番号
CSPST08-560F

コンポーネント説明

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4 Pages

File Size
45.9 kB

メーカー
CMD
California Micro Devices => Onsemi CMD

Product Description
The CSPST is a high performance Integrated Passive Device (IPD) which provides series terminations suitable for use in high speed bus applications. Eight (8) or sixteen (16) series termination versions are provided. These resistors provide excellent high frequency performance in excess of 3GHz and are manufactured to an absolute tolerance as low as ±1%. The Chip Scale Package provides an ultra small footprint for this IPD and provides minimal parasitics compared to conventional packaging. Typical bump inductance is less than 25pH. The large solder bumps and ceramic substrate allow for standard attachment to laminate printed circuit boards without the use of underfill.


FEATUREs
• 8 or 16 integrated high frequency series terminations
• Ultra small footprint Chip Scale Package
• Ceramic substrate
• 0.35mm Eutectic Solder Bumps, 0.65mm pitch


APPLICATIONs
• Series resistive bus termination
• Isolated resistor array

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