FEATURES
• Stability ΔR/R = 1 % for 1000 h at 70 ° C
• 2 mm pitch packaging option for 0603 size
• Pure tin solder contacts on Ni barrier layer provides compatibility with lead (Pb)-free and lead containing soldering processes
• Metal glaze on high quality ceramic
• AEC-Q200 qualified
• Material categorization: For definitions of compliance please see www.vishay.com/doc?99912