C2955 データシートの表示（PDF） - Hamamatsu Photonics

部品番号

コンポーネント説明

一致するリスト

C2955

INFRARED IC INTERNAL INSPECTION SYSTEM

Hamamatsu Photonics 

SPECIFICATIONS

q Infrared CCD Camera (camera head, camera control unit)

Imaging device .............................................. 2/3-inch infrared CCD

Spectral response .........................................400 nm to 1200 nm

No. of pixels .................................................. 380,000

Effective photocathode size ......................... 6.3 × 4.7 mm

Power consumption ..................................... 20 VA

q Video Monitor

CRT ............................................................... 12-inch/Black and white, high-resolution model

Resolution (horizontal center) ...................... 900 TV lines min.

Power consumption ..................................... 38 VA

q Infrared Microscope

Optical path switching .................................. 100 : 0 / 0 : 100 (eyepiece/camera)

Stage travel area .......................................... 153 × 153 mm

Epi-illuminated light source .......................... 12 V, 100 W halogen lamp

Revolver ........................................................ 5 holes

Infrared objectives ........................................ 10 ×, 20 ×, 50 × (optional: 5 ×, 100 × 1)

q Environmental Conditions

Ambient operating temperature range ......... 0 to +40°C

Ambient storage temperature range ............ -10 to +50°C

Ambient operating/storage humidity ............ 90% max. (with no condensation)

Line voltage................................................... 100 VAC ± 10%, 50/60 Hz

COMPONENTS

• Infrared CCD camera

• Camera control unit

• Video monitor

• Infrared microscope (including light source

dimmer transformer*)

• Cables: 1 set

* Specify the line voltage at ordering.

OPTIONS

• C7103 IC Backside Polishing System

IMAGE EXAMPLE

APPLICATIONS

• Inspection of flip-chip and other packaged IC

devices

• Testing for abnormalities (defects, failures) in

metal and polysilicon wiring

• Observation of wire bonding

• Observation of various types of die bonding zones

• Simultaneous inspection of Al-Si nodules and

multiple patterns

• Observation of pattern diffusion into substrate

• Identification of ESD failure locations

• Subject to local technical requirements and regulations, availability of products included in this promotional material may vary.

Please consult with our sales office.

• Information furnished by HAMAMATSU is believed to be reliable. However, no responsibility is assumed for possible inaccuracies

or omissions. Specifications and external appearance are subject to change without notice.

© 1999 Hamamatsu Photonics K.K.

ISO 9001/ISO 13485

EN 46001

Certificate: 09 105 79045

Homepage Address http://www.hamamatsu.com

HAMAMATSU PHOTONICS K.K., Systems Division

812 Joko-cho, Hamamatsu City, 431-3196, Japan, Telephone: (81)53-431-0124, Fax: (81)53-435-1574, E-mail:export@sys.hpk.co.jp

U.S.A. and Canada: Hamamatsu Photonic Systems: 360 Foothill Road, Bridgewater, N.J. 08807-0910, U.S.A., Telephone: (1)908-231-1116, Fax: (1)908-231-0852

Germany: Hamamatsu Photonics Deutschland GmbH: Arzbergerstr. 10, D-82211 Herrsching am Ammersee, Germany, Telephone: (49)8152-375-0, Fax: (49)8152-2658

France: Hamamatsu Photonics France S.A.R.L.: 8, Rue du Saule Trapu, Parc du Moulin de Massy, 91882 Massy Cedex, France, Telephone: (33)1 69 53 71 00, Fax: (33)1 69 53 71 10

United Kingdom: Hamamatsu Photonics UK Limited: Lough Point, 2 Gladbeck Way, Windmill Hill, Enfield, Middlesex EN2 7JA, United Kingdom, Telephone: (44)208-367-3560, Fax: (44)208-367-6384

North Europe: Hamamatsu Photonics Norden AB: Smidesvägen 12, SE-171-41 Solna, Sweden, Telephone: (46)8-509-031-00, Fax: (46)8-509-031-01

Italy: Hamamatsu Photonics Italia S.R.L.: Strada della Moia, 1/E 20020 Arese (Milano), Italy, Telephone: (39)02-935 81 733, Fax: (39)02-935 81 741

Cat. No. SSIS 1025E02

JUL/99 CR

Created in Japan (PDF)

Share Link: