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HMC341(V01) データシートの表示(PDF) - Hittite Microwave

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一致するリスト
HMC341
(Rev.:V01)
Hittite
Hittite Microwave Hittite
HMC341 Datasheet PDF : 6 Pages
1 2 3 4 5 6
v01.1007
Absolute Maximum Ratings
Drain Bias Voltage (Vdd)
+5.5 Vdc
RF Input Power (RFIN)(Vdd = +3.0 Vdc) +3 dBm
Channel Temperature
175 °C
Continuous Pdiss (T = 85 °C)
(derate 3.44 mW/°C above 85 °C)
0.310 W
Thermal Resistance
(channel to die bottom)
290 °C/W
Storage Temperature
-65 to +150 °C
Operating Temperature
-55 to +85 °C
ELECTROSTATIC SENSITIVE DEVICE
OBSERVE HANDLING PRECAUTIONS
Outline Drawing
HMC341
GaAs MMIC LOW NOISE
AMPLIFIER, 24 - 30 GHz
1
Die Packaging Information [1]
Standard
Alternate
GP-2 (Gel Pack)
[2]
[1] Refer to the “Packaging Information” section for die
packaging dimensions.
[2] For alternate packaging information contact Hittite
Microwave Corporation.
NOTES:
1. ALL DIMENSIONS ARE IN INCHES [MM]
2. DIE THICKNESS IS .004”
3. TYPICAL BOND IS .004” SQUARE
4. BACKSIDE METALLIZATION: GOLD
5. BOND PAD METALLIZATION: GOLD
6. BACKSIDE METAL IS GROUND.
7. CONNECTION NOT REQUIRED FOR UNLABELED BOND PADS.
For price, delivery and to place orders: Hittite Microwave Corporation, 20 Alpha Road, Chelmsford, MA 01824
Phone: 978-250-3343 Fax: 978-250-3373 Order On-line at www.hittite.com
Application Support: Phone: 978-250-3343 or apps@hittite.com
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