TSL2571 データシートの表示（PDF） - austriamicrosystems AG
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TSL2571 Datasheet PDF : 25 Pages
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TSL2571
LIGHT-TO-DIGITAL CONVERTER
TAOS117A − FEBRUARY 2011
MECHANICAL DATA
PACKAGE FN
Dual Flat No-Lead
TOP VIEW
466 + 10
PIN OUT
TOP VIEW
PIN 1
VDD 1
6 SDA
466
+ 10
lid 2000 + 100
SCL 2
5 INT
GND 3
4 NC
ill va END VIEW
G st 650 + 50
2000
+ 100
Photodiode Array Area
295
Nominal
s A nt BOTTOM VIEW
e CL of Photodiode Array Area
m t (Note B)
CL of Solder Contacts
20 Nominal
SIDE VIEW
203 + 8
650
300
+ 50
icaal con PIN1
140 Nominal
CL of Solder Contacts
CL of Photodiode Array Area (Note B)
n Pb 750 + 150
Lead Free
h NOTES: A. All linear dimensions are in micrometers. Dimension tolerance is ± 20 μm unless otherwise noted.
B. The die is centered within the package within a tolerance of ± 3 mils.
c C. Package top surface is molded with an electrically nonconductive clear plastic compound having an index of refraction of 1.55.
D. Contact finish is copper alloy A194 with pre-plated NiPdAu lead finish.
e E. This package contains no lead (Pb).
TF. This drawing is subject to change without notice.
Figure 12. Package FN — Dual Flat No-Lead Packaging Configuration
Copyright E 2011, TAOS Inc.
20
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www.taosinc.com
The LUMENOLOGY r Company
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