RMDA25000 データシートの表示（PDF） - Fairchild Semiconductor
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RMDA25000 Datasheet PDF : 6 Pages
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RMDA25000
23-28 GHz Driver Amplifier MMIC
Figure 1
Functional Block
Diagram
RF IN
MMIC Chip
Drain Supply Vd
ADVANCED INFORMATION
RF OUT
Figure 2
Chip Layout and Bond Pad
locations.
Dimensions in mm
Chip size is 2.79 mm x
1.63 mm x 50 µm. Back of
chip is RF and DC ground.
Ground (Back of Chip) Gate Supply Vg
0.115
1.303
Figure 3
Recommended
Application Schematic
Circuit Diagram
0.0
0.115
0.0
Bond Wire Ls
1.895
Drain Supply
10000pF (Vd= +5 V)
100pF
100pF 100pF
2.614
1.629
1.452
1.028
0.843
0.658
0.177
2.614 2.794
MMIC Chip
RF IN
RF OUT
Ground
(Back of Chip)
100pF
100pF 100pF
Bond Wire Ls
10000pF
Gate Supply
(Vg)
Characteristic performance data and specifications are subject to change without notice.
Revised April 16, 2001
Page 2
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