RMWM26001 データシートの表示（PDF） - Fairchild Semiconductor
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RMWM26001 Datasheet PDF : 6 Pages
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5 MIL THICK
ALUMINA
50Ω
RF INPUT/OUTPUT
DIE-ATTACH
80Au/20Sn
5 MIL THICK
ALUMINA
50Ω
5 MIL THICK
ALUMINA
50Ω
LO INPUT
RF INPUT/OUTPUT
L < 0.015"
(6 Places)
2 MIL GAP
Note:
Use 0.003" by 0.0005" Gold Ribbon for bonding. RF input and output bonds should be less than 0.015" long with stress relief.
Figure 3. Recommended Assembly Diagram
Recommended Procedure for Operation
The RMWM26001 does not require bias. Apply RF input signal at the appropriate frequency band and input drive level.
©2004 Fairchild Semiconductor Corporation
RMWM26001 Rev. D
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