RMWM38001 データシートの表示（PDF） - Fairchild Semiconductor
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RMWM38001 Datasheet PDF : 5 Pages
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IF INPUT/OUTPUT
5 MIL THICK
ALUMINA 50Ω
DIE-ATTACH
80 Au/20 Sn
5 MIL THICK
ALUMINA
50Ω
LO INPUT
5 MIL THICK
ALUMINA
50Ω
RF INPUT/OUTPUT
2 MIL GAP
L < 0.015"
(6 Places)
Figure 3. Recommend Assembly Diagram1
Note:
1: Use 0.003” by 0.0005” Gold Ribbon for bonding. RF input and output bonds should be less than 0.015” long with stress relief.
Recommended Procedure for Operation
CAUTION: THIS IS AN ESD SENSITIVE DEVICE
The RMWM38001 does not require DC bias. Apply RF input signal
at the appropriate frequency band and input driver level.
©2004 Fairchild Semiconductor Corporation
RMWM38001 Rev. D
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