Table of Contents
1 Ordering Information and IC Marking ........................................................................ 5
2 Block Diagram ............................................................................................................. 5
3 Pinout and Package Information ................................................................................ 6
3.1 Pin Description ...................................................................................................................................... 6
3.2 Package Description ............................................................................................................................. 8
4 Electrical Specifications ............................................................................................. 9
4.1 Absolute Ratings ................................................................................................................................... 9
4.2 Recommended Operating Conditions ................................................................................................... 9
4.3 DC Electrical Characteristics ............................................................................................................... 10
5 Clocking 10
5.1 Crystal Oscillator ................................................................................................................................. 10
5.2 Low Power Oscillator...........................................................................................................................11
6 CPU and Memory Subsystems ................................................................................. 12
6.1 Processor ............................................................................................................................................ 12
6.2 Memory Subsystem............................................................................................................................. 12
6.3 Non-volatile Memory (eFuse) .............................................................................................................. 12
7 WLAN Subsystem...................................................................................................... 13
7.1 MAC 13
7.1.1 Features ................................................................................................................................. 13
7.1.2 Description..............................................................................................................................13
7.2 PHY 14
7.2.1 Features ................................................................................................................................. 14
7.2.2 Description..............................................................................................................................14
7.3 Radio 14
7.3.1 Receiver Performance ............................................................................................................ 14
7.3.2 Transmitter Performance ........................................................................................................ 16
8 External Interfaces .................................................................................................... 17
8.1 I2C Slave Interface .............................................................................................................................. 17
8.2 I2C Master Interface ............................................................................................................................ 19
8.3 SPI Slave Interface.............................................................................................................................. 19
8.4 UART 22
8.5 Wi-Fi/Bluetooth Coexistence ...............................................................................................................23
8.6 GPIOs 23
9 Power Management ................................................................................................... 24
9.1 Power Architecture .............................................................................................................................. 24
9.2 Power Consumption ............................................................................................................................ 25
9.2.1 Description of Device States...................................................................................................25
9.2.2 Current Consumption in Various Device States......................................................................25
9.2.3 Restrictions for Power States ................................................................................................. 26
9.3 Power-Up/Down Sequence ................................................................................................................. 26
9.4 Digital I/O Pin Behavior during Power-Up Sequences......................................................................... 28
Atmel ATWINC1500B-MU [DATASHEET]
Atmel-42487B-ATWINC1500B-MU_Datasheet_03/2016
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