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83135-50 データシートの表示(PDF) - STMicroelectronics

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83135-50 Datasheet PDF : 6 Pages
1 2 3 4 5 6
AM83135-050
RF & MICROWAVE TRANSISTORS
S-BAND RADAR APPLICATIONS
. REFRACTORY/GOLD METALLIZATION
. EMITTER SITE BALLASTED
. RUGGEDIZED VSWR 3:1 @ 1dB
OVERDRIVE
. LOW THERMAL RESISTANCE
. INPUT/OUTPUT MATCHING
. OVERLAY GEOMETRY
. METAL/CERAMIC HERMETIC PACKAGE
. POUT = 50 W MIN. WITH 5.2 dB GAIN
.310 x .310 2LFL (S064)
hermetically sealed
O RDER CODE
BRANDING
DE SC RI P TI O N
AM83135-050
83135-50
The AM83135-050 device is a high power silicon
bipolar NPN transistor specifically designed for S-
Band radar pulsed output and driver applications.
PIN CONNECTION
This device is characterized at 10 µsec pulsewidth
and 10% duty cycle, but is capable of operation
over a range of pulse widths, duty cycles and tem-
peratures and can withstand a 3:1 output VSWR
with a +1 dB input overdrive. Low RF thermal re-
sistance, refractory/gold metallization, and com-
puterized automatic wire bonding techniques en-
sure high reliability and product consistency (in-
cluding phase characteristics).
The AM83135-050 is supplied in the IMPACHer-
metic Metal/Ceramic package with internal In-
put/Output impedance matching circuitry, and is
intended for military and other high reliability ap-
plications.
1. Collector
2. Base
3. Emitter
4. Base
ABSOLUTE MAXIMUM RATINGS (Tcase = 25°C)
Sy mb o l
Parameter
Va l u e
Unit
PD IS S
Power Dissipation* (TC 125°C)
312
W
IC
Device Current*
8.0
A
VCC
Collector-Supply Voltage*
48
V
TJ
Junction Temperature (Pulsed RF Operation)
250
°C
TSTG
Storage Temperature
65 to +200
°C
THERMAL DATA
RTH(j-c) Junction-Case Thermal Resistance*
*Applies only to rated RF amplifier operation
November 27, 1996
0.40
°C/W
1/6

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