BA7664AFV データシートの表示（PDF） - ROHM Semiconductor

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BA7664AFV

Y/C MIX Circuit built-in Video Driver

ROHM Semiconductor 

BA7664AFV

●Equivalent circuit

Pin.No Pin name

IN OUT Voltage

1

5

MUTEA

MUTEB

○

―

―

Technical Note

Equivalent circuit

15k

14k

Function

Mute control terminal

Pin1 MUTEA - “H” = mute on

Pin5 MUTEB - “H” = only

chroma mute on

2

YIN

○―

2.0V

Signal input terminal

Sync-tip-clamp input for the

composite Y signal.

3

GND

――

0V

4

CIN

○―

2.0V

GND

20k

Pin6

6

7

MIXOUT2

MIXOUT1

―

○

0.9V

0.95V

Pin7

VCC

8

VCC

――

5.0V

Ground terminal

Signal input terminal

This pin is a chroma signal

input. Input terminal is 20kΩ.

Signal output terminal

Pin7 is Y/C MIX signal

output terminal.

Power save mode is active

when output is set under

0.2V.

Pin6 is a sag compensator

input.

Power supply terminal

●Cautions on use

1. Numbers and data in entries are representative design values and are not guaranteed values of the items.

2. Although ROHM is confident that the example application circuit reflects the best possible recommendations, be sure to

verify circuit characteristics for your particular application. Modification of constants for other externally connected circuits

may cause variations in both static and transient characteristics for external components as well as this ROHM IC. Allow

for sufficient margins when determining circuit constants.

3. Absolute maximum ratings

Use of the IC in excess of absolute maximum ratings, such as the applied voltage or operating temperature range

(Topr), may result in IC damage. Assumptions should not be made regarding the state of the IC (short mode or open

mode) when such damage is suffered. A physical safety measure, such as a fuse, should be implemented when using

the IC at times where the absolute maximum ratings may be exceeded.

4. GND potential

Ensure a minimum GND pin potential in all operating conditions. Make sure that no pins are at a voltage below the

GND at any time, regardless of whether it is a transient signal or not.

5. Thermal design

Perform thermal design, in which there are adequate margins, by taking into account the permissible dissipation (Pd)

in actual states of use.

6. Short circuit between terminals and erroneous mounting

Pay attention to the assembly direction of the ICs. Wrong mounting direction or shorts between terminals, GND, or other

components on the circuits, can damage the IC.

7. Operation in strong electromagnetic field

Using the ICs in a strong electromagnetic field can cause operation malfunction.

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© 2009 ROHM Co., Ltd. All rights reserved.

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2009.04 - Rev.A

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