MASW-002103-001SMB データシートの表示（PDF） - M/A-COM Technology Solutions, Inc.

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MASW-002103-001SMB

Silicon SPDT Surface Mount HMIC PIN Diode Switch 50 MHz - 20 GHz

M/A-COM Technology Solutions, Inc. 

MASW-002103-1363

Silicon SPDT Surface Mount HMIC PIN Diode Switch

50 MHz - 20 GHz

Rev. V11

Features

 Usable up to 26 GHz

 Low Insertion Loss

 High Isolation

 Low Parasitic Capacitance and Inductance

 RoHS Compliant Surmount Package

 Rugged, Fully Monolithic

 Glass Encapsulated Construction

 Up to +38 dBm CW Power Handling @ +25°C

 Silicon Nitride Passivation

 Polymer Scratch Protection

 Solderable

Description

The MASW-002103-1363 is a SPDT, surmount,

broadband, monolithic switch using two sets of

series and shunt connected PIN diodes. This device

is designed for use in broadband, low to moderate

signal, high performance, switch applications up to

20 GHz. It is a surface mountable switch configured

for optimized performance and offers a distinct

advantage over MMIC, beamlead and chip and wire

hybrid designs. Because the PIN diodes of the

MASW-002103-1363 are integrated into the chip

and kept within close proximity, the parasitics

typically associated with other designs that use

individual components are kept to a minimum.

To minimize the parasitics and achieve high

performance the MASW-002103-1363 is fabricated

using MACOM’s HMIC (Heterolithic Microwave

Integrated Circuit) process. This process allows the

silicon pedestals, which form the series and shunt

diodes or vias, to be imbeded in low loss, low

dispersion glass. The combination of low loss glass

and using tight spacing between elements results in

an HMIC device with low loss and high isolation

through low millimeter wave frequencies.

The topside is fully encapsulated with silicon nitride

and also has an additional layer of polymer for

scratch and impact protection. The protective

coating guards against damage to the junction and

the anode airbridges during handling and assembly.

On the backside of the chip gold metalized pads

have been added to produce a solderable surmount

device.

Functional Schematic

J3

J1

J2

Pin Configuration

Pin

J1

J2

J3

Function

RFC

RF1

RF2

Ordering Information

Part Number

MASW-002103-13630G

MASW-002103-13635P

MASW-002103-13630P

MASW-002103-001SMB

Package

50 piece gel pack

500 piece reel

3000 piece reel

Sample Test Board

MASW-002103-002SMB

Demo Board

1

M/A-COM Technology Solutions Inc. (MACOM) and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice.

Visit www.macom.com for additional data sheets and product information.

For further information and support please visit:

https://www.macom.com/support

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