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MC10XS3435DPNA データシートの表示(PDF) - Freescale Semiconductor

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一致するリスト
MC10XS3435DPNA
Freescale
Freescale Semiconductor Freescale
MC10XS3435DPNA Datasheet PDF : 51 Pages
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DEVICE VARIATIONS
DEVICE VARIATIONS
Table 1. Device Variations
Characteristic
Symbol
Min
Typ
Max
Unit
Wake Input Clamp Voltage , ICL(WAKE) < 2.5 mA
VCL(WAKE)
10XS3435B
18
10XS3435D
20
V
25
32
27
35
Fault Detection Blanking Time
tFAULT
μs
10XS3435B
-
5.0
20
10XS3435D
-
5.0
10
Output Shutdown Delay Time
tDETECT
10XS3435B
-
10XS3435D
-
μs
7.0
30
7.0
20
Peak Package Reflow Temperature During Reflow(1), (2)
TPPRT
Note 2
°C
1. Pin soldering temperature limit is for 10 seconds maximum duration. Not designed for immersion soldering. Exceeding these limits may
cause malfunction or permanent damage to the device.
2. Freescale’s Package Reflow capability meets Pb-free requirements for JEDEC standard J-STD-020C. For Peak Package Reflow
Temperature and Moisture Sensitivity Levels (MSL), Go to www.freescale.com, search by part number [e.g. remove prefixes/suffixes and
enter the core ID to view all orderable parts (i.e. MC33xxxD enter 33xxx), and review parametrics.
10XS3435
2
Analog Integrated Circuit Device Data
Freescale Semiconductor

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