CF1155 データシートの表示（PDF） - Nippon Precision Circuits
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CF1155 Datasheet PDF : 8 Pages
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CF1155 series
PAD LAYOUT and COORDINATES
(Unit: µm)
VDD OUT OUT
3
2
1
TC 4
(1230,1230)
T2 5
T1 6
11 VSS
7
8
9
10
(0,0) VSS TO OSH LH
Chip size: 1.23 × 1.23mm
Chip thickness: 300 ± 30µm
T1, T2, TC, and TO bonding is not required.
Number
1
2
3
4
5
6
7
8
9
10
11
Pad dimensions (Unit: µm)
Pad
X
Y
OUT
930
1075
OUT
529
1075
VDD
155
1075
TC
155
887
T2
155
608
T1
155
420
VSS
223
155
TO
486
155
OSH
750
155
LH
1041
155
VSS
1075
420
PAD DESCRIPTION
Name
OSH, LH
OUT, OUT
VDD
VSS
T1, T2, TC
TO
Function
Melody mode control inputs. Built-in pull-down resistors mean LOW-level signals are obtained when inputs are open circuit. The
resistance of the pull-down resistor varies with the applied voltage, as described in the Electrical Characteristics.
Piezoelectric speaker driver outputs. Both pins are LOW in non-play mode. OUT is LOW and OUT is HIGH during output for a
musical rest note. Both pins are HIGH during the gap between musical notes.
Supply. The rear surface of the chip is VDD level.
Ground
Test inputs. Pull-down resistor built-in.
Test output. The oscillator frequency (typ. 50kHz) is output for monitoring purposes.
SEIKO NPC CORPORATION —2
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