EMP114 データシートの表示（PDF） - Excelics Semiconductor, Inc.
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EMP114 Datasheet PDF : 2 Pages
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PRELIMINARY DATA SHEET
ASSEMBLY DRAWING
EMP114
7.0 – 9.0 GHz Power Amplifier MMIC
The length of RF wires should be as short as possible. Use at least two wires between RF pad and 50 ohm line
and separate the wires to minimize the mutual inductance.
CHIP OUTLINE
Chip Size 2000 x 2650 microns
Chip Thickness: 75 ± 13 microns
PAD Dimensions: 100 x 100 microns
All Dimensions in Microns
Specifications are subject to change without notice.
Excelics Semiconductor, Inc. 310 De Guigne Drive, Sunnyvale, CA 94085
page 2 of 2
Phone: 408-737-1711 Fax: 408-737-1868 Web: www.excelics.com
Revised September 2004
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