SK100LVE111EPJ データシートの表示（PDF） - Semtech Corporation
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SK100LVE111EPJ Datasheet PDF : 6 Pages
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SK100LVE111E
HIGH-PERFORMANCE PRODUCTS
Package Information
–N–
PIN Descriptions
–L–
28 Pin PLCC Package
Y BRK
B 0.007 (0.180) M T L - M S N S
D
U 0.007 (0.180) M T L - M S N S
+
Z
W
D
V
28
1
A 0.007 (0.180) M T L – M S N S
Z
R 0.007 (0.180) M T L – M S N S
C
E
G
G1
0.010 (0.250) S T L – M S N S
0.004 (0.100)
J –T– SEATING PLANE
VIEW S
+
X
G1 0.010 (0.250) S T L - M S N S
H
0.007(0.180) M T L – M S N S
K1
View S
K
F 0.007 (0.180) M T L – M S N S
NOTES:
1. Datums -L-, -M-, and -N- determined where top of lead
shoulder exits plastic body at mold parting line.
2. DIM G1, true position to be measured at Datum -T-,
Seating Plane.
3. DIM R and U do not include mold flash. Allowable mold flash
is 0.010 (0.250) per side.
4. Dimensioning and tolerancing per ANSI Y14.5M, 1982.
5. Controlling Dimension: Inch.
6. The package top may be smaller than the package bottom by
up to 0.012 (0.300). Dimensions R and U are determined at
the outermost extremes of the plastic body exclusive of mold
flash, tie bar burrs, gate burrs and interlead flash, but
including any mismatch between the top and bottom of the
plastic body.
7. Dimension H does not include Dambar protrusion or
intrusion. The Dambar protrusion(s) shall not cause the H
dimension to be greater than 0.037 (0.940). The Dambar
intrusion(s) shall not cause the H dimension to be smaller
than 0.025 (0.635).
Revision 2/ April 30, 2002
3
INCHES
MILLIMETERS
DIM MIN MAX MIN MAX
A
0.485 0.495 12.32 12.57
B
0.485 0.495 12.32 12.57
C
0.165 0.180 4.20 4.57
E
0.090 0.110 2.29 2.79
F
0.013 0.019 0.33 0.48
G
0.050 BSC
1.27 BSC
H 0.026 0.032 0.66 0.81
J
0.020
--
0.51
--
K
0.025
--
0.64
--
R
0.450 0.456 11.43 11.58
U 0.450 0.456 11.43 11.58
V
0.042 0.048 1.07 1.21
W 0.042 0.048 1.07 1.21
X
0.042 0.056 1.07 1.42
Y
--
0.020
--
0.50
Z
2o
10o
2o
10o
G1 0.410 0.430 10.42 10.92
K1 0.040
--
1.02
--
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