HIP1011D データシートの表示（PDF） - Renesas Electronics
部品番号
コンポーネント説明
一致するリスト
HIP1011D Datasheet PDF : 15 Pages
| |||
HIP1011D, HIP1011E
Shrink Small Outline Plastic Packages (SSOP)
Quarter Size Outline Plastic Packages (QSOP)
N
INDEX
AREA
H
E
-B-
0.25(0.010) M B M
GAUGE
PLANE
123
-A- D
SEATING PLANE
A
L
0.25
0.010
h x 45°
-C-
e
A1
A2
C
B
0.10(0.004)
0.17(0.007) M C A M B S
NOTES:
1. Symbols are defined in the “MO Series Symbol List” in Section 2.2
of Publication Number 95.
2. Dimensioning and tolerancing per ANSI Y14.5M-1982.
3. Dimension “D” does not include mold flash, protrusions or gate
burrs. Mold flash, protrusion and gate burrs shall not exceed
0.15mm (0.006 inch) per side.
4. Dimension “E” does not include interlead flash or protrusions. Inter-
lead flash and protrusions shall not exceed 0.25mm (0.010 inch)
per side.
5. The chamfer on the body is optional. If it is not present, a visual in-
dex feature must be located within the crosshatched area.
6. “L” is the length of terminal for soldering to a substrate.
7. “N” is the number of terminal positions.
8. Terminal numbers are shown for reference only.
9. Dimension “B” does not include dambar protrusion. Allowable dam-
bar protrusion shall be 0.10mm (0.004 inch) total in excess of “B”
dimension at maximum material condition.
10. Controlling dimension: INCHES. Converted millimeter dimensions
are not necessarily exact.
M28.15
28 LEAD SHRINK SMALL OUTLINE PLASTIC PACKAGE
(0.150” WIDE BODY)
INCHES
MILLIMETERS
SYMBOL MIN
MAX
MIN
MAX NOTES
A
0.053 0.069 1.35
1.75
-
A1
0.004 0.010 0.10
0.25
-
A2
-
0.061
-
1.54
-
B
0.008 0.012 0.20
0.30
9
C
0.007 0.010 0.18
0.25
-
D
0.386 0.394 9.81 10.00
3
E
0.150 0.157 3.81
3.98
4
e
0.025 BSC
0.635 BSC
-
H
0.228 0.244 5.80
6.19
-
h
0.0099 0.0196 0.26
0.49
5
L
0.016 0.050 0.41
1.27
6
N
28
28
7
0°
8°
0°
8°
-
Rev. 1 6/04
© Copyright Intersil Americas LLC 1999-2004. All Rights Reserved.
All trademarks and registered trademarks are the property of their respective owners.
For additional products, see www.intersil.com/en/products.html
Intersil products are manufactured, assembled and tested utilizing ISO9001 quality systems as noted
in the quality certifications found at www.intersil.com/en/support/qualandreliability.html
Intersil products are sold by description only. Intersil may modify the circuit design and/or specifications of products at any time without notice, provided that such
modification does not, in Intersil's sole judgment, affect the form, fit or function of the product. Accordingly, the reader is cautioned to verify that datasheets are
current before placing orders. Information furnished by Intersil is believed to be accurate and reliable. However, no responsibility is assumed by Intersil or its
subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result from its use. No license is granted by implication or
otherwise under any patent or patent rights of Intersil or its subsidiaries.
For information regarding Intersil Corporation and its products, see www.intersil.com
FN4725 Rev 5.00
November 18, 2004
Page 15 of 15
Share Link: 