![](/html/Sony/923650/page14.png)
Package Outline
Unit: mm
24PIN SSOP(PLASTIC)
∗7.8 ± 0.1
24
13
A
+ 0.2
1.25 – 0.1
0.1
CXB1585N
1
+ 0.1
0.22 – 0.05
0.13 M
12
0.65
+ 0.05
0.15 – 0.02
0.1 ± 0.1
NOTE: “∗” Dimensions do not include mold protrusion.
0° to 10°
DETAIL A
SONY CODE
EIAJ CODE
JEDEC CODE
SSOP-24P-L01
SSOP024-P-0056
PACKAGE STRUCTURE
PACKAGE MATERIAL
LEAD TREATMENT
LEAD MATERIAL
EPOXY RESIN
SOLDER/PALLADIUM
PLATING
42/COPPER ALLOY
PACKAGE WEIGHT
0.1g
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