NCP565 データシートの表示（PDF） - ON Semiconductor
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NCP565 Datasheet PDF : 15 Pages
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NCP565, NCV565
Table 1. Bill of Materials for NCP565 Adj Demonstration Board
Item Used #
Component
Designators
1
4
Radial Lead Aluminum Capacitor
150 mF/16 V
C1, C2, C3, C5
2
1
Radial Lead Aluminum Capacitor
C4
10 mF/10 V
3
1
SMT Chip Resistor (0805) 15.8 K 1%
R2
4
1
SMT Chip Resistor (0805) 42.2 K 1%
R1
5
1
SMT Ceramic Capacitor (0603) 5.6 pF 10%
C6
6
1
NCP565 Low Dropout Linear Regulator
U1
Suppliers
Sanyo Oscon
Sanyo Oscon
Vishay
Vishay
Vishay
ON Semiconductor
Part Number
16SA150M
10SL10M
CRCW08051582F
CRCW08054222F
VJ0603A5R6KXAA
NCP565D2TR4
Protection Diodes
When large external capacitors are used with a linear
regulator it is sometimes necessary to add protection diodes.
If the input voltage of the regulator gets shorted, the output
capacitor will discharge into the output of the regulator. The
discharge current depends on the value of the capacitor, the
output voltage and the rate at which Vin drops. In the
NCP565 linear regulator, the discharge path is through a
large junction and protection diodes are not usually needed.
If the regulator is used with large values of output
capacitance and the input voltage is instantaneously shorted
to ground, damage can occur. In this case, a diode connected
as shown in Figure 24 is recommended.
1N4002 (Optional)
Vin
Vin
Vout
Vout
NCP565
CAdj
C1 GND Adj
C2
R1
R2
Figure 24. Protection Diode for Large
Output Capacitors
Thermal Considerations
This series contains an internal thermal limiting circuit
that is designed to protect the regulator in the event that the
maximum junction temperature is exceeded. This feature
provides protection from a catastrophic device failure due to
accidental overheating. It is not intended to be used as a
substitute for proper heat sinking. The maximum device
power dissipation can be calculated by:
PD
+
TJ(max) *
RqJA
TA
200
180
160
140
120
100
80
60
40
0
DFN 1 oz Cu
DFN 2 oz Cu
SOT−223 1 oz Cu
SOT−223 2 oz Cu
D2PAK 1 oz Cu
D2PAK 2 oz Cu
50 100 150 200 250 300 350 400 450 500
COPPER HEAT−SPREADER AREA (mm sq)
Figure 25. Thermal Resistance
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