PS9601L データシートの表示（PDF） - NEC => Renesas Technology

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PS9601L

HIGH ISOLATION VOLTAGE HIGH SPEED PHOTOCOUPLER

NEC => Renesas Technology 

PS9601, PS9601L

PRECAUTIONS IN MOUNTING THE DEVICE

(1) Precautions in mounting the device by infrared reflow soldering

• Peak reflow temperature : 235 ˚C or below (Plastic surface temperature)

• Reflow time

: 30 seconds or less (Time period during which the plastic surface temperature

is 210 ˚C)

• Number of reflow processes: One

• Flux

: Rosin flux containing small amount of chlorine (The flux with a maximum

chlorine content of 0.2 Wt% is recommended.)

INFRARED RAY REFLOW TEMPERATURE PROFILE

120 to 160 ˚C

60 to 90 s

(Pre-heat)

(Actual heat)

to 10 s

to 30 s

235 ˚C Peak

210 ˚C

Times (s)

Peak Temperature 230 ˚C

or Lower

(2) Precautions in mounting the device in solder dip method

• Temperature

: 260 ˚C or lower

• Time

: 10 sec. or less

• Flux

: Rosin group flux, where the amount of chloride component is small.

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